Title :
Experimental evaluation of the E-band multi-chip modules integrated using laminated LCP substrates
Author :
Dyadyuk, Val ; Stokes, Leigh ; Merkle, Thomas
Author_Institution :
CSIRO ICT Centre, Sydney, NSW, Australia
Abstract :
Early results of implementation of System-in-Package integration technique in the E-band using multi-chip module laminated (MCM-L) techniques on multi-layer liquid crystal polymer substrate are presented. Several prototypes have been developed with commercial and proprietary millimeter wave monolithic integrated circuits embedded into LCP MCM-L. Feasibility of this technique has been demonstrated with measured performance close to simulation predictions.
Keywords :
MMIC; multichip modules; polymers; system-in-package; E-band multichip modules integrated; MCM-L technique; MMIC; experimental evaluation; laminated LCP substrates; millimeter wave monolithic integrated circuits; multilayer liquid crystal polymer substrate; system-in-package integration technique; Coplanar waveguides; Frequency measurement; Loss measurement; Microstrip; Semiconductor device measurement; Substrates; Transmission line measurements; Millimeter-wave frequencies; integrated module; millimeter-wave integrated circuit (MMIC);
Conference_Titel :
Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS), 2011 IEEE MTT-S International
Conference_Location :
Sitges
Print_ISBN :
978-1-61284-963-8
DOI :
10.1109/IMWS3.2011.6061885
