Experimental evaluation of the E-band multi-chip modules integrated using laminated LCP substrates

Author

Dyadyuk, Val ; Stokes, Leigh ; Merkle, Thomas

Author_Institution

CSIRO ICT Centre, Sydney, NSW, Australia

fYear

2011

fDate

15-16 Sept. 2011

Firstpage

53

Lastpage

56

Abstract

Early results of implementation of System-in-Package integration technique in the E-band using multi-chip module laminated (MCM-L) techniques on multi-layer liquid crystal polymer substrate are presented. Several prototypes have been developed with commercial and proprietary millimeter wave monolithic integrated circuits embedded into LCP MCM-L. Feasibility of this technique has been demonstrated with measured performance close to simulation predictions.

Keywords

MMIC; multichip modules; polymers; system-in-package; E-band multichip modules integrated; MCM-L technique; MMIC; experimental evaluation; laminated LCP substrates; millimeter wave monolithic integrated circuits; multilayer liquid crystal polymer substrate; system-in-package integration technique; Coplanar waveguides; Frequency measurement; Loss measurement; Microstrip; Semiconductor device measurement; Substrates; Transmission line measurements; Millimeter-wave frequencies; integrated module; millimeter-wave integrated circuit (MMIC);

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS), 2011 IEEE MTT-S International

Conference_Location

Sitges

Print_ISBN

978-1-61284-963-8

Type

conf

DOI

10.1109/IMWS3.2011.6061885

Filename

6061885