DocumentCode
2072405
Title
Thermal coastline - leadframes for high power at no cost
Author
Moore, Tom
Author_Institution
Package Dev. Group, Analog Devices BV, Limerick, Ireland
fYear
1997
fDate
18-21 May 1997
Firstpage
332
Lastpage
337
Abstract
The Thermal Coastline design is the arrangement of a leadframe in a plastic encapsulated IC in which the paddle and the leads are laid out to create a high thermal conductivity path across the moulding compound. It allows up to fifty percent more heat to be dissipated by a standard outline package at little or no extra cost. Standard materials and processes are used throughout assembly. The devices can be manufactured at any assembly site. The design has been implemented in numerous packages, in both dual-in-line and quad styles, and these are assembled (in millions of units) at several locations world-wide
Keywords
encapsulation; integrated circuit packaging; plastic packaging; thermal conductivity; IC; Thermal Coastline; assembly; dual-in-line package; heat dissipation; leadframe; moulding compound; plastic encapsulation; quad package; thermal conductivity; Additives; Analog integrated circuits; Assembly; Conducting materials; Costs; Integrated circuit packaging; Manufacturing; Plastic integrated circuit packaging; Plastics industry; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606189
Filename
606189
Link To Document