• DocumentCode
    2072405
  • Title

    Thermal coastline - leadframes for high power at no cost

  • Author

    Moore, Tom

  • Author_Institution
    Package Dev. Group, Analog Devices BV, Limerick, Ireland
  • fYear
    1997
  • fDate
    18-21 May 1997
  • Firstpage
    332
  • Lastpage
    337
  • Abstract
    The Thermal Coastline design is the arrangement of a leadframe in a plastic encapsulated IC in which the paddle and the leads are laid out to create a high thermal conductivity path across the moulding compound. It allows up to fifty percent more heat to be dissipated by a standard outline package at little or no extra cost. Standard materials and processes are used throughout assembly. The devices can be manufactured at any assembly site. The design has been implemented in numerous packages, in both dual-in-line and quad styles, and these are assembled (in millions of units) at several locations world-wide
  • Keywords
    encapsulation; integrated circuit packaging; plastic packaging; thermal conductivity; IC; Thermal Coastline; assembly; dual-in-line package; heat dissipation; leadframe; moulding compound; plastic encapsulation; quad package; thermal conductivity; Additives; Analog integrated circuits; Assembly; Conducting materials; Costs; Integrated circuit packaging; Manufacturing; Plastic integrated circuit packaging; Plastics industry; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1997. Proceedings., 47th
  • Conference_Location
    San Jose, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3857-X
  • Type

    conf

  • DOI
    10.1109/ECTC.1997.606189
  • Filename
    606189