Title :
Thermal coastline - leadframes for high power at no cost
Author_Institution :
Package Dev. Group, Analog Devices BV, Limerick, Ireland
Abstract :
The Thermal Coastline design is the arrangement of a leadframe in a plastic encapsulated IC in which the paddle and the leads are laid out to create a high thermal conductivity path across the moulding compound. It allows up to fifty percent more heat to be dissipated by a standard outline package at little or no extra cost. Standard materials and processes are used throughout assembly. The devices can be manufactured at any assembly site. The design has been implemented in numerous packages, in both dual-in-line and quad styles, and these are assembled (in millions of units) at several locations world-wide
Keywords :
encapsulation; integrated circuit packaging; plastic packaging; thermal conductivity; IC; Thermal Coastline; assembly; dual-in-line package; heat dissipation; leadframe; moulding compound; plastic encapsulation; quad package; thermal conductivity; Additives; Analog integrated circuits; Assembly; Conducting materials; Costs; Integrated circuit packaging; Manufacturing; Plastic integrated circuit packaging; Plastics industry; Thermal conductivity;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606189