Title :
Free-space optical link realized with microlensed components
Author :
Strzelecka, E.M. ; Louderback, D.A. ; Bertilsson, K. ; Thibeault, B.J. ; Mondry, M. ; Coldren, L.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
Higher computer clock speeds will require alternate technologies to overcome the performance limitations of backplane electrical interconnections. One such method is to use parallel free-space beams for board-to-board interconnects. We demonstrate a free-space optical link using 980 nm vertical-cavity lasers (VCLs) as transmitters and back-side illuminated double-pass Schottky diodes as receivers. These devices are integrated on-chip with refractive microlenses, resulting in components that can be used directly in systems, without the need for external optics. A single-mode dielectrically-apertured VCL of diameter 3.1 μm integrated with a microlens, has a far-field divergence half-angle of ~1 degree, allowing for an interconnect length of ~5 mm. VCLs of this size have bandwidths ~15 GHz at powers ~1 mW, suitable for high-speed optical interconnects. We have studied the tolerance of the free-space link to mechanical misalignments and to fabrication variations by evaluating the power throughput and crosstalk from adjacent channels positioned on a 250 μm pitch. The misalignment tolerances were also evaluated experimentally. We achieved data transmission at 400 Mbit/s with bit error rate (BER) <10-12 through the free-space system with microlensed components. The data rate is presently limited by the packaging, not the inherent bandwidth of the VCL. We have also demonstrated data transmission at 3 Gbit/s with BER<10-12 by launching signal from the microlensed VCL directly to a fiber-coupled high-speed receiver
Keywords :
data communication; error statistics; flip-chip devices; integrated optoelectronics; laser beam applications; lenses; microassembling; optical crosstalk; optical interconnections; optical links; optical receivers; optical transmitters; photodetectors; semiconductor device packaging; semiconductor laser arrays; surface emitting lasers; 1 mW; 15 GHz; 3 Gbit/s; 400 Mbit/s; 980 nm; BER; VCSEL transmitters; back-side illuminated Schottky diodes; backplane interconnections; bit error rate; board-to-board interconnects; crosstalk; data transmission; free-space optical link; high-speed optical interconnects; mechanical misalignment tolerance; microlensed components; packaging; parallel free-space beams; refractive microlenses; vertical-cavity SEL; Bandwidth; Bit error rate; Data communication; Lenses; Microoptics; Optical fiber communication; Optical interconnections; Optical receivers; Optical refraction; Optical transmitters;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606197