DocumentCode
2072853
Title
Free-space optical link realized with microlensed components
Author
Strzelecka, E.M. ; Louderback, D.A. ; Bertilsson, K. ; Thibeault, B.J. ; Mondry, M. ; Coldren, L.A.
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fYear
1997
fDate
18-21 May 1997
Firstpage
376
Lastpage
381
Abstract
Higher computer clock speeds will require alternate technologies to overcome the performance limitations of backplane electrical interconnections. One such method is to use parallel free-space beams for board-to-board interconnects. We demonstrate a free-space optical link using 980 nm vertical-cavity lasers (VCLs) as transmitters and back-side illuminated double-pass Schottky diodes as receivers. These devices are integrated on-chip with refractive microlenses, resulting in components that can be used directly in systems, without the need for external optics. A single-mode dielectrically-apertured VCL of diameter 3.1 μm integrated with a microlens, has a far-field divergence half-angle of ~1 degree, allowing for an interconnect length of ~5 mm. VCLs of this size have bandwidths ~15 GHz at powers ~1 mW, suitable for high-speed optical interconnects. We have studied the tolerance of the free-space link to mechanical misalignments and to fabrication variations by evaluating the power throughput and crosstalk from adjacent channels positioned on a 250 μm pitch. The misalignment tolerances were also evaluated experimentally. We achieved data transmission at 400 Mbit/s with bit error rate (BER) <10-12 through the free-space system with microlensed components. The data rate is presently limited by the packaging, not the inherent bandwidth of the VCL. We have also demonstrated data transmission at 3 Gbit/s with BER<10-12 by launching signal from the microlensed VCL directly to a fiber-coupled high-speed receiver
Keywords
data communication; error statistics; flip-chip devices; integrated optoelectronics; laser beam applications; lenses; microassembling; optical crosstalk; optical interconnections; optical links; optical receivers; optical transmitters; photodetectors; semiconductor device packaging; semiconductor laser arrays; surface emitting lasers; 1 mW; 15 GHz; 3 Gbit/s; 400 Mbit/s; 980 nm; BER; VCSEL transmitters; back-side illuminated Schottky diodes; backplane interconnections; bit error rate; board-to-board interconnects; crosstalk; data transmission; free-space optical link; high-speed optical interconnects; mechanical misalignment tolerance; microlensed components; packaging; parallel free-space beams; refractive microlenses; vertical-cavity SEL; Bandwidth; Bit error rate; Data communication; Lenses; Microoptics; Optical fiber communication; Optical interconnections; Optical receivers; Optical refraction; Optical transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location
San Jose, CA
ISSN
0569-5503
Print_ISBN
0-7803-3857-X
Type
conf
DOI
10.1109/ECTC.1997.606197
Filename
606197
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