Title :
Properties of Ag nanoparticle paste for room temperature bonding
Author :
Wakuda, Daisuke ; Kim, Keun-Soo ; Suganuma, Katsuaki
Author_Institution :
Res. Fellow, Japan Soc. for the Promotion of Sci., Suita
Abstract :
Time-dependent sintering properties of Ag nanoparticle paste for room temperature bonding were investigated. The Ag nanoparticle paste with very small amount of alkylamine dispersant can sinter at room temperature by drying toluene solvent. When the solvent evaporates, sintering with necking growth and coalescence of particles is provoked at least within half an hour and the Ag grain continues to grow gradually for hours. Time-dependent alteration of the shear strength is demonstrated through bonding test at room temperature using Cu plates. Bonding between Ag paste and Cu plate is favorable and breaking occurs inside sintered Ag body. The strength of Ag increases with the progress of sintering at room temperature. The shear strength reaches over 8 MPa after 6 and 12 h drying process.
Keywords :
bonding processes; copper; drying; grain growth; nanoparticles; nanotechnology; necking; plates (structures); shear strength; silver; sintering; Ag-Cu; alkylamine dispersant; breaking; drying; grain growth; nanoparticle paste; necking growth; particle coalescence; plates; room temperature bonding; shear strength; sintering; temperature 293 K to 298 K; time 12 h; time 6 h; toluene solvent; Bonding; Heating; Inorganic materials; Methanol; Nanoparticles; Solvents; Stability; Temperature; Testing; X-ray diffraction;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074220
