DocumentCode
2073058
Title
Characterisation of metal coated polymer balls for BGA and CSP applications
Author
Kristiansen, Helge ; Whalley, David ; Tyldum, Hallvard ; Redford, Keith
Author_Institution
Conpart AS, Skjetten
fYear
2009
fDate
26-29 May 2009
Firstpage
1563
Lastpage
1568
Abstract
A metal-coated ball based on a polymer core is under development for chip scale packaging (CSP) and ball grid array (BGA) applications. Different polymer cores have been produced and evaluated in order to optimise the mechanical properties of the ball. From a range of candidates with highly diverse properties, a candidate material has been proposed. This decision is based on a combination of a very low thermal expansion coefficient of 25 ppM/0C and E-modulus, which is of the order of 600 MPa.
Keywords
ball grid arrays; chip scale packaging; polymerisation; polymers; thermal expansion; BGA; CSP; E-modulus; ball grid array; chip scale packaging; metal coated polymer balls; thermal expansion coefficient; Assembly; Chip scale packaging; Electronics packaging; Instruments; Mechanical factors; Optical polymers; Polymer films; Soldering; Testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074221
Filename
5074221
Link To Document