Title :
Electromagnetic noise reduction of TEG package using novel ferrite film plated lead frame
Author :
Ono, Hiroshi ; Kondo, Koichi ; Masuda, Norio
Author_Institution :
Mater. Dev. Center, NEC TOKIN Corp.
Abstract :
A test element group (TEG) package with magnetic thin film noise suppressor had fabricated in order to improve electromagnetic interference within package level, and a basic performance against noise in GHz region had tested. The noise suppressor employed here is a lead frame which coated its surface with Ni-Zn ferrite film by plating. Conduction noise up to 5 GHz is reduced with the TEG package.
Keywords :
electric noise measurement; electronics packaging; electroplating; ferrites; magnetic thin films; microwave devices; nickel alloys; zinc alloys; Ni-Zn; conduction noise; electromagnetic interference; electromagnetic noise reduction; ferrite film plated lead frame; magnetic thin film noise suppressor; test element group package; Electromagnetic interference; Ferrite films; Magnetic films; Magnetic materials; Magnetic noise; National electric code; Noise level; Noise reduction; Packaging; Semiconductor device noise;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074223
