• DocumentCode
    2073133
  • Title

    Fully embedded UWB filter into organic packaging substrate

  • Author

    Lim, Sung P. ; Park, Jae Y.

  • Author_Institution
    Micro/Nano Devices & Packaging Lab. Electron. Eng., Kwangwoon Univ., Seoul
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    1585
  • Lastpage
    1589
  • Abstract
    In this paper, a compact ultra wideband bandpass filter has been newly designed and implemented by embedding all the passive components into an organic packaging substrate for compact 3.1 - 4.75 GHz UWB system applications. In order to reduce a size of the filter and avoid unwanted EM coupling among the embedded filter circuit elements, it was designed by using a modified 3rd cehbyshev circuit topology and J-inverter transformation technology. It was comprised of three shunt-type LC resonators, two capacitance J-inverters, two extra transmission zero inductors, and one extra transmission zero capacitor. The capacitor and inductors generate finite transmission zeros to enhance rejection characteristics at independent proper sides. The measured maximum insertion loss in the passband ranged from 3.1 to 4.75 GHz was better than 1.68 dB, with a minimum value of 0.78 dB at 3.75 GHz. And the return loss was higher than 12 dB in the passband. The transmission zeros of the measured response occurred at 2.2, and 5.15 GHz, and provided suppressions of 31 dB at 2.4 GHz(ISM band) and 20 dB at 5.15 GHz(wireless LAN band), respectively. Group delay was lower than 0.62 ns in the passbnad. The size of the designed bandpass filter was 2.9 mm times 2.8 mm times 0.55 mm which was much smaller than the ones fabricated onto organic substrate.
  • Keywords
    Chebyshev filters; band-pass filters; capacitors; embedded systems; inductors; microwave filters; resonators; wireless LAN; Chebyshev circuit topology; J-inverter transformation technology; capacitance J-inverters; embedded filter circuit elements; finite transmission zeros; frequency 3.1 GHz to 4.75 GHz; frequency 5.15 GHz; organic packaging substrate; shunt-type LC resonators; transmission zero capacitor; transmission zero inductors; ultra wideband bandpass filter; wireless LAN band; Band pass filters; Capacitors; Circuit topology; Coupling circuits; Filtering theory; Inductors; Packaging; Passband; Resonator filters; Ultra wideband technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074225
  • Filename
    5074225