• DocumentCode
    2073353
  • Title

    An ILP-based automatic bus planner for dense PCBs

  • Author

    Pei-Ci Wu ; Qiang Ma ; Wong, Martin D. F.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2013
  • fDate
    22-25 Jan. 2013
  • Firstpage
    181
  • Lastpage
    186
  • Abstract
    Modern PCBs have to be routed manually since no EDA tools can successfully route these complex boards. An auto-router for PCBs would improve design productivity tremendously since each board takes about 2 months to route manually. This paper focuses on a major step in PCB routing called bus planning. In the bus planning problem, we need to simultaneously solve the bus decomposition, escape routing, layer assignment and global bus routing. This problem was partially addressed by Kong et al. in [3] where they only focused on the layer assignment and global bus routing, assuming bus decomposition and escape routing are given. In this paper, we present an ILP-based solution to the entire bus planning problem. We apply our bus planner to an industrial PCB (with over 7000 nets and 12 signal layers) which was previously successfully routed manually, and compare with a state-of-the-art industrial internal tool where the layer assignment and global bus routing are based on the algorithm in [3]. Our bus planner successfully routed 97.4% of all the nets. This is a huge improvement over the industrial tool which could only achieve 84.7% routing completion for this board.
  • Keywords
    network routing; printed circuits; ILP-based automatic bus planner problem; PCB routing; autorouter; bus decomposition; complex boards; dense PCB; escape routing; global bus routing; industrial PCB; industrial internal tool; layer assignment; Joining processes; Manuals; Pins; Planning; Productivity; Routing; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4673-3029-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2013.6509593
  • Filename
    6509593