Title :
Electrical design and characterization of Si interposer for system-in-package (SiP)
Author :
Kato, Shinobu ; Tango, Tomoyuki ; Hasegawa, Kiyohisa ; Bhandari, Ramesh K. ; Sakai, Atsushi ; Segawa, Hiroshi ; Kariya, Takashi ; Sudo, Toshio
Author_Institution :
R&D Oper., Ibiden Co., Ltd., Ogaki
Abstract :
Si interposer technology has the potential to enable high-bandwidth and low-power image processing devices of the future, because a very high density system with an ultra-fine pitch (les5um) wiring can be fabricated. However, the ultra-fine pitch wiring may adversely affect the electrical performance of devices. This paper discusses the signal propagation properties of ultra-fine coplanar interconnects on Si interposers. A design chart of the interconnects, obtained from the viewpoint of maximum line length versus target operating frequency, is presented.
Keywords :
large scale integration; printed circuits; silicon; system-in-package; Si; image processing devices; interposer technology; line length; maximum line length; system-in-package; target operating frequency; ultra-fine coplanar interconnects; ultrafine pitch wiring; Conductivity; Conductors; Delay; Frequency; Image processing; Integrated circuit interconnections; Large scale integration; Power system interconnection; Propagation losses; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074236
