• DocumentCode
    2073767
  • Title

    Self-Aligned Double and Quadruple Patterning-aware grid routing with hotspots control

  • Author

    Kodama, Chikaaki ; Ichikawa, H. ; Nakayama, Keisuke ; Kotani, T. ; Nojima, S. ; Mimotogi, S. ; Miyamoto, Sadaaki ; Takahashi, Asami

  • Author_Institution
    Semicond. & Storage Products Co., Toshiba Corp., Yokohama, Japan
  • fYear
    2013
  • fDate
    22-25 Jan. 2013
  • Firstpage
    267
  • Lastpage
    272
  • Abstract
    Although Self-Aligned Double and Quadruple Patterning (SADP, SAQP) have become the most promising processes for sub-20 nm and sub-14 nm node advanced technologies, not all wafer images are realized by them. In advanced technologies, feasible wafer images should be generated effectively by utilizing SADP and SAQP where a wafer image is uniquely determined by a selected mandrel pattern. However, predicting the wafer image of a mandrel pattern is not easy. In this paper, we propose a routing method of generating a feasible wafer image satisfying the connection requirements. Routing algorithms comprising simple connecting and cutting rules are performed on a new grid structure where two (SADP) or three colors (SAQP) are assigned alternately to grid-nodes. Then a mandrel pattern is selected without complex coloring or decomposition methods. Also, hotspot reduction by dummy pattern flipping is proposed. In experiments, feasible wafer images meeting the connection requirements are generated and the effectiveness of the proposed framework is confirmed.
  • Keywords
    integrated circuit layout; network routing; SADP; SAQP; complex coloring; connecting rules; connection requirements; cutting rules; decomposition methods; dummy pattern flipping; grid structure; grid-nodes; hotspot reduction; hotspots control; mandrel pattern; routing algorithms; routing method; self-aligned double patterning-aware grid routing; self-aligned quadruple patterning-aware grid routing; wafer images; Color; Image color analysis; Layout; Lithography; Resists; Routing; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4673-3029-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2013.6509607
  • Filename
    6509607