DocumentCode :
2073767
Title :
Self-Aligned Double and Quadruple Patterning-aware grid routing with hotspots control
Author :
Kodama, Chikaaki ; Ichikawa, H. ; Nakayama, Keisuke ; Kotani, T. ; Nojima, S. ; Mimotogi, S. ; Miyamoto, Sadaaki ; Takahashi, Asami
Author_Institution :
Semicond. & Storage Products Co., Toshiba Corp., Yokohama, Japan
fYear :
2013
fDate :
22-25 Jan. 2013
Firstpage :
267
Lastpage :
272
Abstract :
Although Self-Aligned Double and Quadruple Patterning (SADP, SAQP) have become the most promising processes for sub-20 nm and sub-14 nm node advanced technologies, not all wafer images are realized by them. In advanced technologies, feasible wafer images should be generated effectively by utilizing SADP and SAQP where a wafer image is uniquely determined by a selected mandrel pattern. However, predicting the wafer image of a mandrel pattern is not easy. In this paper, we propose a routing method of generating a feasible wafer image satisfying the connection requirements. Routing algorithms comprising simple connecting and cutting rules are performed on a new grid structure where two (SADP) or three colors (SAQP) are assigned alternately to grid-nodes. Then a mandrel pattern is selected without complex coloring or decomposition methods. Also, hotspot reduction by dummy pattern flipping is proposed. In experiments, feasible wafer images meeting the connection requirements are generated and the effectiveness of the proposed framework is confirmed.
Keywords :
integrated circuit layout; network routing; SADP; SAQP; complex coloring; connecting rules; connection requirements; cutting rules; decomposition methods; dummy pattern flipping; grid structure; grid-nodes; hotspot reduction; hotspots control; mandrel pattern; routing algorithms; routing method; self-aligned double patterning-aware grid routing; self-aligned quadruple patterning-aware grid routing; wafer images; Color; Image color analysis; Layout; Lithography; Resists; Routing; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
ISSN :
2153-6961
Print_ISBN :
978-1-4673-3029-9
Type :
conf
DOI :
10.1109/ASPDAC.2013.6509607
Filename :
6509607
Link To Document :
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