Embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)

Author

Suk, Kyoung-Lim ; Son, Ho-Young ; Chung, Chang-Kyu ; Kim, Joong Do ; Lee, Jin-Woo ; Paik, Kyung-Wook

Author_Institution

Dept. of Mater. Sci. & Eng., KAIST, Daejeon

fYear

2009

fDate

26-29 May 2009

Firstpage

1741

Lastpage

1748

Abstract

For maximizing space efficiency and reducing process steps, embedded chip-in-flex (CIF) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs) are one of the innovative packaging technology. This study was focused on the demonstration of CIF packages and their reliability evaluation. WLP was successfully performed in case of void-free ACF lamination on a 50 mum thin wafer, wafer dicing without ACF delamination, and flip-chip assembly which showed stable bump contact resistances. After flex-on-flex (FOF) assembly conditions were optimized, the CIF packages were successfully fabricated. The reliability of the packages such as high temperature/ humidity test (85degC/85% RH), high temperature storage test (HTST), thermal cycling test (T/C) was evaluated. As a summary, the CIF packages showed excellent 85degC/85% RH reliability.

Keywords

anisotropic media; flip-chip devices; laminations; reliability; wafer level packaging; anisotropic conductive films; chip-in-flex packages; flex-on-flex assembly; flip-chip assembly; high temperature storage test; humidity test; reliability; size 50 mum; temperature 85 degC; thermal cycling test; wafer level package; Anisotropic conductive films; Assembly; Delamination; Humidity; Lamination; Packaging; Space technology; Temperature; Testing; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4244-4475-5

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2009.5074251

Filename

5074251