DocumentCode
2074014
Title
Integrated materials enabling TSV/3D-TSV
Author
Itabashi, Toshiaki
Author_Institution
DuPont WLP Solutions, Kawasaki
fYear
2009
fDate
26-29 May 2009
Firstpage
1759
Lastpage
1763
Abstract
There is a consistence flux of miniaturization, value added functionality to IC packaging/modules driven by significant increase of mobile/networking products in the consumer market. The advanced packaging technologies, particularly TSV/3D-TSV approach is driving innovative design and novel applications. This paper examines the challenges for TSV/3D packaging and in particular some material solutions for via creation, via cleaning, via fill, thinning and bonding for stack and assembly.
Keywords
integrated circuit packaging; IC packaging; TSV/3D-TSV; integrated materials; mobile products; networking products; Assembly; Cleaning; Costs; Etching; Foot; Packaging; Plasma applications; Resists; Sulfur hexafluoride; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074254
Filename
5074254
Link To Document