DocumentCode :
2074137
Title :
Repairing Incomplete Measured Data with Haptic Interaction
Author :
Cheng, Siyuan ; Liang, Siquan ; Zhang, Xiangwei
Author_Institution :
Fac. of Electromech. Eng., Guangdong Univ. of Technol., Guangzhou, China
fYear :
2009
fDate :
17-19 Oct. 2009
Firstpage :
1
Lastpage :
5
Abstract :
Measured data of a product can be incomplete because of the inaccessibility or invisibility of some portions of the product surface for measure tools in reverse engineering, which could makes it difficult for reverse engineering systems to create the CAD model from those measured data. In this paper, a novel incomplete data repair method based on haptic interaction is presented. Starting from the import of a dataset digitized from a physical object, various haptic sculpting tools are explored to repair the incomplete measured data, and the shape and size of these tools may be changed dynamically to satisfy specific situations, which forms a flexible and intuitive sculpting toolbox used to clean and repair the measured data. A high-quality STL file can be obtained from the system which is ideal for rapid prototyping. Case study is also given to demonstrate the feasibility of this new method, and finally a future direction of integration repairing measured data with designing innovative new object through haptic interaction in reverse engineering is proposed.
Keywords :
CAD; haptic interfaces; reverse engineering; software prototyping; CAD model; haptic interaction; haptic sculpting tools; incomplete data repair method; incomplete measured data; rapid prototyping; reverse engineering; Data engineering; Haptic interfaces; Imaging phantoms; Laser modes; Prototypes; Reverse engineering; Shape measurement; Size measurement; Solid modeling; Surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Image and Signal Processing, 2009. CISP '09. 2nd International Congress on
Conference_Location :
Tianjin
Print_ISBN :
978-1-4244-4129-7
Electronic_ISBN :
978-1-4244-4131-0
Type :
conf
DOI :
10.1109/CISP.2009.5301080
Filename :
5301080
Link To Document :
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