Title :
Challenges in integration of diverse functionalities on CMOS
Author :
Masu, Kazuya ; Ishihara, Noboru ; Konishi, Tsuyoshi ; Machida, Kenji ; Toshiyoshi, Hiroshi
Author_Institution :
Solutions Res. Lab., Tokyo Inst. of Technol., Yokohama, Japan
Abstract :
We introduce “Wafer Shuttle” that is suitable for integration of diverse functionalities. CMOS/MEMS design flow and environment based on SPICE is discussed. It is pointed out that modeling will be important to promote the R&D of MEMS/CMOS and/or diverse-functionalities integration on CMOS.
Keywords :
CMOS integrated circuits; SPICE; micromechanical devices; research and development; CMOS design flow; MEMS design flow; R&D; SPICE; diverse functionality integration; wafer shuttle; CMOS integrated circuits; Integrated circuit modeling; Mathematical model; Micromechanical devices; SPICE; Semiconductor device modeling; Sensors;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-3029-9
DOI :
10.1109/ASPDAC.2013.6509627
