High temperature deformation of area array packages by moire interferometry/FEM hybrid method

Author

Zhu, Jiansen ; Zou, Daqing ; Liu, Sheng

Author_Institution

Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA

fYear

1997

fDate

18-21 May 1997

Firstpage

444

Lastpage

452

Abstract

In this study, moire interferometry and experimental/FEM hybrid method were applied in the thermal deformation analysis of several area array packages. High frequency gratings of 1200 l/mm and 600 l/mm were replicated onto the cross sections of packages at the elevated temperature of 80°C or 160°C. These packages include an OMPAC BGA and a flip-chip BGA. The thermal deformation of these packages were measured by moire interferometry. Warpage of the packaging systems was measured and the effects of the bonding, encapsulation, soldering, and geometry on the deformation were discussed. The strain distributions inside the solder joints were analyzed by both moire interferometry and experimental/FEM hybrid method

Keywords

deformation; encapsulation; finite element analysis; flip-chip devices; integrated circuit packaging; light interferometry; moire fringes; soldering; 160 C; 80 C; OMPAC BGA; area array packages; flip-chip BGA; high temperature deformation; moire interferometry/FEM hybrid method; solder joints; strain distributions; thermal deformation analysis; warpage; Bonding; Capacitive sensors; Encapsulation; Frequency; Geometry; Gratings; Interferometry; Packaging; Soldering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606208

Filename

606208