Title :
Sequential dependency and reliability analysis of embedded systems
Author :
Hehua Zhang ; Yu Jiang ; Xiaoyu Song ; Hung, William N. N. ; Ming Gu ; Jiaguang Sun
Author_Institution :
Sch. of Software, Tsinghua Univ., Beijing, China
Abstract :
Embedded systems are becoming increasingly popular due to their widespread applications and the reliability of them is a crucial issue. The complexity of the reliability analysis arises in handling the sequential feedback that make the system output depends not only on the present input but also the internal state. In this paper, we propose a novel probabilistic model, named sequential dependency model (SDM), for the reliability analysis of embedded systems with sequential feedback. It is constructed based on the structure of the system components and the signals among them. We prove that the SDM model is s Dynamic Bayesian Network (DBN) that captures: the spatial dependencies between system components in a single time slice, the temporal dependencies between system components of different time slices, and the temporal dependencies due to the sequential feedback. We initiate the conditional probability distribution (CPD) table of the SDM node with the failure probability of the corresponding system component. Then, the SDM model handles the spatial-temporal correlations at internal components as well as the higher order temporal correlations due to the sequential feedback with the computational mechanism of DBN, experiment results demonstrate the accuracy of our model.
Keywords :
embedded systems; failure analysis; reliability; statistical distributions; SDM model; conditional probability distribution table; dynamic Bayesian network; embedded system; failure probability; probabilistic model; reliability analysis; sequential dependency model; sequential feedback; spatial temporal correlation; temporal dependency; Analytical models; Correlation; Embedded systems; Joints; Markov processes; Random variables; Reliability;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-3029-9
DOI :
10.1109/ASPDAC.2013.6509633