Title :
Demonstration of board-level optical link with ceramic optoelectronic multi-chip module
Author :
Nieweglowski, Krzysztof ; Rieske, Ralf ; Wolter, Klaus-Jürgen
Author_Institution :
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden
Abstract :
This paper demonstrates a complete short-distance parallel optical interconnection on PCB-level basing on ceramic transmitter/receiver modules for high-speed signal conversion, integrated polymeric waveguides and the optical coupling elements. The novel technology for the structuring of PCB-compatible high density parallel optical interconnects will be described in detail. The solution for the optical coupling into the integrated waveguides is based on a micro-optical indirect coupling element with wave guiding structures. The demonstrated optoelectronic modules are 4-channel BGA ceramic multi-chip modules with 4 times 10 Gbps transmission capacity.
Keywords :
ball grid arrays; ceramic packaging; integrated optics; integrated optoelectronics; micro-optics; multichip modules; optical couplers; optical interconnections; optical polymers; printed circuits; 4-channel BGA; PCB-level basing; bit rate 10 Gbit/s; board-level optical link; ceramic optoelectronic multichip module; ceramic receiver modules; ceramic transmitter modules; high-speed signal conversion; integrated polymeric waveguides; integrated waveguides; microoptical indirect coupling element; optical coupling elements; short-distance parallel optical interconnection; transmission capacity; waveguiding structures; Ceramics; High speed optical techniques; Integrated circuit technology; Optical coupling; Optical fiber communication; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Printed circuits;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074276
