Title :
HS3DPG: Hierarchical simulation for 3D P/G network
Author :
Shuai Tao ; Xiaoming Chen ; Yu Wang ; Yuchun Ma ; Yiyu Shi ; Hui Wang ; Huazhong Yang
Author_Institution :
Tsinghua Nat. Lab. for Inf. Sci. & Technol. (TNList), Tsinghua Univ., Beijing, China
Abstract :
As different chips are stacked together in 3D ICs, the power/ground (P/G) network simulation becomes more challenging than that of 2D cases. In this paper, we propose a hierarchical simulation method suitable for 3D P/G network (HS3DPG), which can ensure full parallelism and good scalability with the number of tiers. In the IR drop analysis, when there are 9 tiers, the hierarchical method can be 6.5 times faster than the direct full network simulation. The accuracy of HS3DPG has been verified by a 3D P/G network from the industrial design. Besides, we introduce the “locality” property into HS3DPG to further simplify the simulation. Finally, HS3DPG is used to analyze the voltage distribution of a 3D P/G network with clustered TSVs.
Keywords :
integrated circuit modelling; three-dimensional integrated circuits; 3D IC; 3D P/G network; HS3DPG; IR drop analysis; clustered TSV; full parallelism; good scalability; hierarchical simulation method; power/ground network simulation; through silicon via; Computational modeling; Integrated circuit modeling; Jacobian matrices; Ports (Computers); Solid modeling; Three-dimensional displays; Through-silicon vias; 3D P/G network; hierarchical simulation; port equivalent model;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-3029-9
DOI :
10.1109/ASPDAC.2013.6509647
