DocumentCode
2074809
Title
Fretting studies of nanocrystalline Pd, Pd-Ag and Pd-Y films
Author
Trudeau, M.L. ; Braunovic, M. ; Bryden, K.J. ; Ying, J.Y.
Author_Institution
Mater. Technol., Hydro-Quebec, Varennes, Que., Canada
fYear
1996
fDate
16-20 Sept. 1996
Firstpage
383
Lastpage
394
Abstract
In the present work, the effects of fretting on the contact resistance behavior of nanocrystalline Pd, Pd/sub 90/Y/sub 10/ and Pd/sub 60/Ag/sub 40/ films deposited on phosphorous-nickel and phosphorous-bronze plates was investigated. The wires used were bare copper, tin-plated copper and silver-copper (Ag/sub 90/Cu/sub 10/). Some of the wires were also coated with the same nanostructured films. The contact resistance was used to monitor the interaction between the wires and the plates. Following the fretting experiments, the surface of the contact regions was examined using scanning electron microscopy with energy dispersive X-ray detection and by Auger spectroscopy. The microstructure of the different films, as well as the effect of thermal annealing of the film/plate combination were investigated. This study shows that nanostructured films have a large technological potential in the improvement of low current electrical connections.
Keywords
Auger effect; X-ray chemical analysis; annealing; contact resistance; electric connectors; electrical contacts; nanostructured materials; palladium; palladium alloys; scanning electron microscopy; wear; Auger spectroscopy; Pd; PdAg; PdY; contact region surface; contact resistance; energy dispersive X-ray detection; fretting studies; low current electrical connections; nanocrystalline films; scanning electron microscopy; thermal annealing; Contact resistance; Copper; Dispersion; Microstructure; Monitoring; Scanning electron microscopy; Spectroscopy; Surface resistance; Wires; X-ray detection;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 1996. Proceedings of the Forty-Second IEEE Holm Conference on ??. Joint with the 18th International Conference on Electrical Contacts
Conference_Location
Chicago, IL, USA
Print_ISBN
0-7803-3578-3
Type
conf
DOI
10.1109/HOLM.1996.557219
Filename
557219
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