Title :
RF characteristics of dual-actuation CMOS-MEMS RF switches
Author :
Ko, Chih-Hsiang ; Lee, Chiung-I ; Huang, Tsun-Che
Author_Institution :
Micro-Syst. Technol. Center, Ind. Technol. Res. Inst., Tainan
Abstract :
The capacitive type of radio frequency micro-electromechanical systems (RF MEMS) switch is investigated for low driving voltages and low power consumption. The RF MEMS switch is actuated by electro-thermal forces and electrostatic forces at the same time, and then held the status by electrostatic forces only after driving. We also use complementary metal oxide semiconductor (CMOS) technology to integrate MEMS devices and integrated circuits (ICs) into a monolithic chip. The RF MEMS switch is fabricated using standard CMOS process, double poly-silicon four metal (2P4M), and the wet etching of MEMS fabrication is then used for post-processed. Experimental results show that the both actuation mechanisms, electro-thermal and electrostatic forces, are workable. The pull-in voltage of the switch for driving is about 7 volts. The insertion loss and the isolation of RF switch at a frequency of 5 GHz are 2.5 dB and 1.6 dB, respectively.
Keywords :
CMOS integrated circuits; electric fields; etching; microfabrication; microswitches; microwave switches; monolithic integrated circuits; CMOS-MEMS RF switch dual-actuation; MEMS fabrication; complementary metal oxide semiconductor; double poly-silicon four metal; electro-thermal force; electrostatic force; frequency 5 GHz; insertion loss; loss 2.5 dB; low-driving voltage; monolithic chip; poly-silicon four metal; pull-in voltage; radio frequency micro-electromechanical system; voltage 7 V; CMOS integrated circuits; CMOS technology; Electrostatics; Energy consumption; Integrated circuit technology; Low voltage; Microelectromechanical devices; Power semiconductor switches; Radio frequency; Radiofrequency microelectromechanical systems;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074293