Factors in implementing MCM solutions for the high performance systems of the 1990s

It is pointed out that the ability to package VLSI and ULSI circuits in a manner that causes minimum degradation to circuit performance and still meet the desired form-factors in the final system is a key challenge for the 1990s. Conventional packaging configurations are giving way to next-generation solutions with increased emphasis on interconnection technology, thermal management, mechanical issues, and board footprint. Processor roadmaps show 4× to 5× increases in operating frequency over the next five years, and commercial optical systems at 300 MHz are followed by lob versions operating at 1 GHz. Electronic system performance driving factors are discussed, and the resulting constraints for semiconductors, interconnection techniques (including tape automated bond and flip chip), mechanical design, and thermal approaches are addressed. Additional integration of VLSI and ULSI components in the form of modular systems solutions at the multichip module (MCM) level are being developed and produced at the laboratory level, and results are discussed