Title :
CLASS: Combined logic and architectural soft error sensitivity analysis
Author :
Ebrahimi, Mojtaba ; Liang Chen ; Asadi, Hamed ; Tahoori, Mehdi B.
Author_Institution :
Dept. of Comput. Sci., Karlsruhe Inst. of Technol., Karlsruhe, Germany
Abstract :
With continuous technology downscaling, the rate of radiation induced soft errors is rapidly increasing. Fast and accurate soft error vulnerability analysis in early design stages plays an important role in cost-effective reliability improvement. However, existing solutions are suitable for either regular (a.k.a address-based such as memory hierarchy) or irregular (random logic such as functional units and control logic) structures, failing to provide an accurate system-level analysis. In this paper, we propose a hybrid approach integrating architecture-level and logic-level techniques to accurately estimate the vulnerability of all regular and irregular structures within a microprocessor. All error propagation and masking scenarios are carefully handled among these structures. We have evaluated the vulnerability of the OR1200 processor using the proposed approach. Comparison with statistical fault injection shows an average inaccuracy of less than 7% with five orders of magnitude improvement in runtime.
Keywords :
integrated circuit reliability; logic testing; microprocessor chips; radiation hardening (electronics); CLASS; OR1200 processor; architecture-level technique; combined logic and architectural soft error sensitivity analysis; continuous technology downscaling; control logic; cost-effective reliability improvement; design stages; error propagation; functional units; logic-level technique; masking scenarios; memory hierarchy; microprocessor; radiation induced soft errors; soft error vulnerability analysis; statistical fault injection; system-level analysis; Circuit faults; Equations; Hardware design languages; Logic gates; Mathematical model; Microprocessors; Probability;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-3029-9
DOI :
10.1109/ASPDAC.2013.6509664