DocumentCode :
2075145
Title :
Application specified soft error failure rate analysis using sequential equivalence checking techniques
Author :
Tun Li ; Dan Zhu ; Sikun Li ; Yang Guo
Author_Institution :
Sch. of Comput., Nat. Univ. of Defense Technol., Changsha, China
fYear :
2013
fDate :
22-25 Jan. 2013
Firstpage :
608
Lastpage :
613
Abstract :
Soft errors have become a critical challenge as a result of technology scaling. However, to evaluate the influence of soft errors in flip-flop (FF) on the failure of circuit is a hard verification problem. Here, we proposed a novel flip-flop soft error failure rate analysis methodology using sequential equivalence checking (SEC) and taking the application behaviors into consideration, which combines the advantage of formal techniques based approaches in completeness and the advantage of application behaviors in accuracy in differentiating vulnerability of FFs. As a result, all the FFs in a circuit are sorted by their failure rates and designers can use this information to perform optimal hardening of selected sequential components against soft errors. Experimental results on an implementation of a SpaceWire end node and the set of the largest ISCAS´89 benchmark sequential circuits demonstrate the efficiency of our approach. Case study on an instruction decoder of a practical 32 bits microprocessor shows the applicable of our methodology.
Keywords :
flip-flops; radiation hardening (electronics); sequential circuits; application specified soft error failure rate analysis; benchmark sequential circuits; flip-flop; hard verification problem; sequential equivalence checking techniques; spacewire end node; technology scaling; Benchmark testing; Circuit faults; Computational modeling; Integrated circuit modeling; Robustness; Silicon; Vectors; Application; Failure rate analysis; Sequential equivalence checking; Soft-error;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
ISSN :
2153-6961
Print_ISBN :
978-1-4673-3029-9
Type :
conf
DOI :
10.1109/ASPDAC.2013.6509665
Filename :
6509665
Link To Document :
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