Title :
Ultra-wide-band (UWB) band-pass-filter using integrated passive device (IPD) technology for wireless applications
Author :
Lee, Yong-Taek ; Liu, Kai ; Frye, Robert ; Kim, Hyun-Tai ; Kim, Gwang ; Ahn, Billy
Author_Institution :
STATS ChipPAC Ltd., Ichon
Abstract :
Recently, the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. In this paper, the design of an ultra-wide-band (UWB) band-pass-filter (BPF) with a pass-band frequency bandwidth from 7.0 GHz to 9.0 GHz (15 dB return loss bandwidth) is described. The UWB BPF makes use of lumped integrated passive device (IPD) technology on a silicon substrate for wireless applications. This filter shows 2.0 dB insertion loss from 7.0 GHz to 9.0 GHz. The UWB filter of flip-chip version has size of 1.4 mm times 1.2 mm times 0.40 mm (including bump height). To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size while achieving equivalent electrical performance.
Keywords :
band-pass filters; elemental semiconductors; flip-chip devices; integrated circuit technology; silicon; ultra wideband technology; Si; consumer device; flip-chip version; frequency 7.0 GHz; frequency 9.0 GHz; high speed data transmission; integrated passive device technology; loss 15 dB; loss 2.0 dB; pass-band frequency bandwidth; silicon substrate; size 0.40 mm; size 1.2 mm; size 1.4 mm; ultra-wide-band band-pass-filter design; wireless applications; Application specific integrated circuits; Band pass filters; Bandwidth; Costs; Dielectric substrates; Inductors; Radio frequency; Radiofrequency integrated circuits; Silicon; Ultra wideband technology;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074295