Title :
Two and three-dimensional modeling of VSPA butt solder joints
Author :
Murphy, R. Sean ; Sitaraman, Suresh K.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The objective of this work is to develop two- and three-dimensional numerical models of VSPA, a new peripheral array package, and study its solder joint reliability. VSPA has multiple rows of butt-type leads around its periphery and is surface mounted on a standard FR-4 printed circuit board. The FR-4 and various package materials were modeled as temperature-dependent and elastic while the eutectic solder was modeled as temperature-dependent, elastic-plastic. The package and board assembly were subjected to a temperature increase (ΔT) of 85°C with the assumption that the assembly is stress-free at room temperature. The results obtained from a three-dimensional 1/8th section model are compared with the results from 2-D plane-strain and plane-stress models and with 3-D “strip” models
Keywords :
circuit reliability; finite element analysis; integrated circuit packaging; plastic packaging; soldering; surface mount technology; thermal stresses; 2-D plane-strain models; 2-D plane-stress models; 3-D strip models; FR-4 printed circuit board; VSPA butt solder joints; butt-type leads; elastic material; eutectic solder; multiple rows; numerical models; peripheral array semiconductor package; solder joint reliability; surface mounting; temperature increase; temperature-dependent elastic-plastic material; temperature-dependent materials; three-dimensional modeling; two-dimensional modeling; Assembly; Electronic packaging thermal management; Electronics packaging; Fatigue; Lead; Semiconductor device packaging; Soldering; Temperature; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606211
