DocumentCode
2075223
Title
Low Diameter Unicast On-Chip Interconnection Networks for Many-Core Embedded Systems
Author
Sibai, Fadi N.
Author_Institution
Coll. of IT, UAE Univ., Al Ain, United Arab Emirates
fYear
2010
fDate
15-18 Feb. 2010
Firstpage
944
Lastpage
949
Abstract
It is critical for the network-on-chip in embedded multi-core and many-core chips to be scalable while limiting power consumption. With the router power dominating the network´s power, one way to achieve this goal is by the design of on-chip interconnection networks with small diameters and simple routing. Herein, we present a few new unicast on-chip networks for interconnecting the cores with diameters superior to the popular 2D mesh.
Keywords
embedded systems; multiprocessing systems; multiprocessor interconnection networks; network-on-chip; embedded systems; many-core chips; multicore chips; network-on-chip; on-chip interconnection networks; router power; unicast on-chip networks; Broadcasting; Delay; Embedded system; Energy consumption; Multiprocessor interconnection networks; Network-on-a-chip; Power system interconnection; System-on-a-chip; Unicast; Yarn; On-chip interconnection networks; many core embedded systems; network diameter;
fLanguage
English
Publisher
ieee
Conference_Titel
Complex, Intelligent and Software Intensive Systems (CISIS), 2010 International Conference on
Conference_Location
Krakow
Print_ISBN
978-1-4244-5917-9
Type
conf
DOI
10.1109/CISIS.2010.15
Filename
5447393
Link To Document