DocumentCode
2075649
Title
Reliability considerations in parallel optical interconnects
Author
Guidotti, Daniel ; Estevez, Claudio ; Fan, Shu-Hao ; Chang, Gee-Kung
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear
2009
fDate
26-29 May 2009
Firstpage
2081
Lastpage
2085
Abstract
Random failure in a population of lasers after burn-in has profound consequences for the deployment of the optical backplane in high performance computing. It is argued that without an effective field repair strategy the mean time between fails for a large population of lasers can become prohibitive. A field repair strategy must be an integral part of the system design from the outset and must be based on low component replacement cost, minimum system down time, minimum redundancy, and low mass fabrication cost for the replaceable sub-assembly. It is further argued that an example of an acceptable repair strategy is based on an active and electrically pluggable optical harness consisting of a parallel array of polymer waveguides on a flexible substrate. Lasers and photodetectors are pre-aligned to the waveguides and make the harness active. Low cost is ensured by a parallel fabrication process in which all waveguides are simultaneously aligned to their respective lasers and photodetectors in one step.
Keywords
integrated optoelectronics; optical backplanes; optical waveguides; photodetectors; photodiodes; polymers; reliability; semiconductor lasers; effective field repair strategy; field repair strategy; flexible substrate; lasers; low component replacement cost; mass fabrication cost; minimum system down time; optical backplane; parallel optical interconnects; parallel polymer waveguides array; photodetectors; redundancy; reliability considerations; repair strategy; system design; Backplanes; Costs; High performance computing; Optical arrays; Optical device fabrication; Optical interconnections; Optical polymers; Optical waveguides; Photodetectors; Waveguide lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074311
Filename
5074311
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