Title :
New chip device with built-in optical outlet rod for easy assembly and high optical coupling in optical interconnection
Author :
Kanda, Masahiro ; Ogawa, Tomonori ; Mikami, Osamu
Author_Institution :
Grad. Sch. of Sci. & Technol., Tokai Univ., Hiratsuka
Abstract :
New chip devices - designed with an optical outlet rod surrounded by cladding - have been proposed to realize easy assembly, high-efficiency optical interconnection. Prototypes have been fabricated using a photomask transfer method employing a VCSEL (vertical cavity emitting laser) and two kinds of UV (ultraviolet) curable resin. Observation of the NFP (near-field pattern), I-L (current vs. light output power) characteristics, the eye pattern for signal transmission and positional tolerance shows that outlet rods with a diameter of 30 mum efficiently confine the laser beam as an optical waveguide. In addition, the ray tracing simulation indicates that transmission loss and crosstalk can be substantially reduced by choosing suitable resins.
Keywords :
claddings; integrated optics; integrated optoelectronics; laser cavity resonators; masks; optical crosstalk; optical fabrication; optical interconnections; optical materials; optical waveguides; ray tracing; rods (structures); surface emitting lasers; UV curable resin; VCSEL fabrication; high-efficiency optical interconnection; high-optical coupling; laser beam optical waveguide; near-field pattern; new chip device; optical chip; optical outlet rod cladding; photomask transfer method; ray tracing simulation; signal transmission eye pattern; size 30 mum; transmission loss crosstalk; vertical cavity emitting laser; Assembly; Optical beams; Optical coupling; Optical crosstalk; Optical devices; Optical interconnections; Optical waveguides; Resins; Stimulated emission; Waveguide lasers;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074313
