Hybrid optical interconnection module with built-in electrical power line for mobile phone using highly-flexible integrally-formed OE-FPC

In order to meet increasing demand for higher-speed signal transmission and smaller electromagnetic noise, we propose the hybrid optical interconnection module with built-in electrical power lines as highly practical optoelectronic interconnection in mobile phones. Highly-flexible integrally-formed OE-FPC with high productivity and reliability was utilized in this module. Optical semiconductor devices and ICs driving such optical devices were all mounted on the OE-FPC by ultrasonic flip-chip bonding method, realizing highly reliable module. With this hybrid optical interconnection module, high-speed signal transmission was demonstrated at over 10 Gbps/ch and such high-speed optical signal transmission was realized actually by the power supply through the low-resistance built-in electrical power lines.