Title :
Low-power 3D integrated ferromagnetic computing
Author :
Becherer, M. ; Breitkreutz, S. ; Eichwald, I. ; Ziemys, G. ; Kiermaier, J. ; Csaba, G. ; Schmitt-Landsiedel, D.
Author_Institution :
Lehrstuhl fur Tech. Elektron., Tech. Univ. Munchen, München, Germany
Abstract :
As CMOS scaling becomes more and more challenging there is strong impetus for beyond CMOS device research to add new functionality to ICs. In this article, a promising technology with non-volatile ferromagnetic computing states - the so-called perpendicular Nanomagnetic Logic (pNML) - is reviewed. After introducing the 2D planar implementation of NML with magnetization perpendicular to the surface, the path to monolithically 3D integrated systems is discussed. Instead of CMOS substitution, additional functionality is added by a coprocessor architecture as a prospective back-end-of-line (BEOL) process. The unconventional computation in the ferromagnetic domain can lead to highly dense computing structures without leakage currents, atto-joule dissipation per bit operation and data-throughputs comparable to state-of-the-art high-performance CMOS CPUs.
Keywords :
CMOS integrated circuits; coprocessors; logic circuits; nanomagnetics; three-dimensional integrated circuits; 2D planar implementation; BEOL process; CMOS device research; CMOS scaling; atto-joule dissipation; back-end-of-line process; coprocessor architecture; data-throughputs; ferromagnetic domain; high-performance CMOS CPU; highly-dense computing structures; low-power 3D integrated ferromagnetic computing; monolithic 3D integrated systems; nonvolatile ferromagnetic computing states; pNML; perpendicular nanomagnetic logic; Logic gates; Magnetic domain walls; Magnetic domains; Magnetic hysteresis; Perpendicular magnetic anisotropy; Three-dimensional displays;
Conference_Titel :
Ultimate Integration on Silicon (EUROSOI-ULIS), 2015 Joint International EUROSOI Workshop and International Conference on
Conference_Location :
Bologna
DOI :
10.1109/ULIS.2015.7063788