DocumentCode
2075884
Title
Novel application-specific LED packaging with compact freeform lens
Author
Wang, Kai ; Liu, Sheng ; Chen, Fei ; Liu, Zongyuan ; Luo, Xiaobing
Author_Institution
Div. of MOEMS, Wuhan Nat. Lab. for Optoelectron., Wuhan
fYear
2009
fDate
26-29 May 2009
Firstpage
2125
Lastpage
2130
Abstract
High power white light emitting diodes (LEDs) have begun to play an important role in many illumination applications due to their excellent performance. In this paper, an effective freeform lens design method for extended light source was suggested briefly for the first time and two compact LED packaging freeform lenses, with the material of polycarbonate (PC) and silicone respectively, were designed based on this method. Two novel application-specific LED packages, whose manufacturing processes are compatible with current LED packaging processes, were also presented for street lighting. By comparing with the traditional LED illumination module consisting of an LED and a secondary optical element, the novel application-specific LED package has the advantages of low profile, small volume, high light output efficiency, low cost and convenience for customers to use. Since the application-specific LED packages provide effective solutions to high performance and low cost LED fixtures, they will probably become the trend of LED packages.
Keywords
electronics packaging; lenses; light emitting diodes; application specific LED packaging; compact freeform lens; high power white light emitting diodes; polycarbonate; secondary optical element; silicone; Costs; Design methodology; Lenses; Light emitting diodes; Light sources; Lighting; Manufacturing processes; Optical design; Optical materials; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074319
Filename
5074319
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