Production solution for metallization of microelectronics - UBM of semiconductor devices and electrode of SAW filter devices

While evaporation technology was used for many years in the metallization of microelectronic devices, the current state-of-the-art manufacturing system for metallization is sputtering systems with high throughput. To provide ideal mass-production solutions, SUNIC continually has optimized and extended the SUNICOAT series. In this paper, we introduce several sputtering systems among the SUNICOAT series with production solutions for metallization of microelectronics, especially UBM and SAW filter. SUNIC has developed and supplied SUNICOAT IS-3000 with high throughput and reliability for UBM process and SUNICOAT 4000 with below 1% uniformity for SAW filter devices. Furthermore, SUNICOAT 4000V with below 0.5% uniformity is being developed