Production solution for metallization of microelectronics - UBM of semiconductor devices and electrode of SAW filter devices

Author

Park, Yeong-ho ; Kim, Jong-seok ; Shim, Kyu-cheol ; Gil, Tae-hyun ; Lee, Eune-jik ; Chun, Huigon

Author_Institution

Res. & Dev. Center, SUNIC Syst. Ltd, Suwon, South Korea

Volume

2

fYear

2001

fDate

26 Jun-3 Jul 2001

Firstpage

280

Abstract

While evaporation technology was used for many years in the metallization of microelectronic devices, the current state-of-the-art manufacturing system for metallization is sputtering systems with high throughput. To provide ideal mass-production solutions, SUNIC continually has optimized and extended the SUNICOAT series. In this paper, we introduce several sputtering systems among the SUNICOAT series with production solutions for metallization of microelectronics, especially UBM and SAW filter. SUNIC has developed and supplied SUNICOAT IS-3000 with high throughput and reliability for UBM process and SUNICOAT 4000 with below 1% uniformity for SAW filter devices. Furthermore, SUNICOAT 4000V with below 0.5% uniformity is being developed

Keywords

chip scale packaging; electrodes; flip-chip devices; semiconductor device packaging; sputter deposition; surface acoustic wave filters; SAW filter; SUNICOAT 4000; SUNICOAT 4000V; SUNICOAT IS-3000; SUNICOAT series; UBM; electrode; flip chip technology; mass-production solutions; semiconductor devices; sputtering systems; throughput; under bump metallization; Electrodes; Metallization; Microelectronics; Production; SAW filters; Semiconductor device packaging; Semiconductor devices; Sputtering; Surface acoustic waves; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Science and Technology, 2001. KORUS '01. Proceedings. The Fifth Russian-Korean International Symposium on

Conference_Location

Tomsk

Print_ISBN

0-7803-7008-2

Type

conf

DOI

10.1109/KORUS.2001.975256

Filename

975256