DocumentCode :
2077304
Title :
Modification of Ag-plated contacts by nitrogen ion implantation
Author :
Sun, Ming ; Rong, Mingzhe ; Wang, Qiping ; Chen, Degui
Author_Institution :
Xi´´an Jiaotong Univ., China
fYear :
1996
fDate :
16-20 Sept. 1996
Firstpage :
467
Lastpage :
471
Abstract :
This paper focuses on the effect of nitrogen ion implantation on performance of Ag-plated contacts in a connector. The implant energy is 32-40 keV and implanted doses are between 1/spl sim/4/spl times/10/sup 17/ ions/cm/sup 2/. The wear abrasion and friction tests were made on implanted and unimplanted contacts with an insertion-withdrawal testing apparatus. Moreover, in order to find the anticorrosion ability of the contacts, the diluted sulfuric acid corrosion tests were also made for those specimens. Surface hardness as well as contact resistance were measured during experiments. With the implanted contacts, the performance was found to be more stable and better than those which were unimplanted. By means of SEM micrographs, the paper attempts to explain the mechanisms of the wear resistance, stability of contact resistance, and anticorrosion in implanted contacts. It has been shown that it is a very promising way to improve properties of Ag-plated contacts.
Keywords :
contact resistance; electric connectors; electrical contacts; friction; ion implantation; silver; wear; 32 to 40 keV; Ag; SEM micrographs; anticorrosion ability; connector; contact resistance; friction tests; implant energy; insertion-withdrawal testing apparatus; ion implantation; plated contacts; surface hardness; wear abrasion; Connectors; Contact resistance; Corrosion; Electrical resistance measurement; Friction; Implants; Ion implantation; Nitrogen; Surface resistance; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 1996. Proceedings of the Forty-Second IEEE Holm Conference on ??. Joint with the 18th International Conference on Electrical Contacts
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-3578-3
Type :
conf
DOI :
10.1109/HOLM.1996.557228
Filename :
557228
Link To Document :
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