Title :
CAE study on dynamic environments of the off-axis TMA Multi-spectral Remote Sensor
Author :
Geng, Qixian ; Li, Zhuo
Author_Institution :
Coll. of Mech. Eng., Beihua Univ., Jilin, China
Abstract :
In order to assess dynamic characteristic of the off-axis TMA Multi-spectral Remote Sensor, CAE technology is used to analysis the remote sensor´ dynamic stiffness and dynamic response. A dynamic model of remote sensor is established, the natural frequency of remote sensor is solved. The stress and acceleration responses of the remote sensor in the environment perturbations (low-frequency sine sweep vibration, random vibration and other conditions) are analyzed. The numerical analysis results show that, the multi-spectral remote sensor has high dynamic stiffness, which ensure remote sensor the capability to resist interference in the space mechanics environmental conditions. The remote sensor design is feasible. Practice shows that the application of CAE technology and finite element analysis on space remote sensors for dynamic simulation analysis, can validate the strength and stiffness rationality of space remote sensor design, indicate remote sensor´s response to the dynamic environment, and guide the dynamic environment test effectively.
Keywords :
dynamic response; finite element analysis; interference suppression; numerical analysis; remote sensing; sensor fusion; CAE technology; dynamic environment testing; dynamic response; dynamic simulation analysis; dynamic stiffness; environment perturbation; finite element analysis; interference resistance; low-frequency sine sweep vibration; numerical analysis; off-axis TMA multispectral remote sensor; random vibration; remote sensor response; space environmental condition; space remote sensor design; three-mirror off-axis aspherical optical system; Acceleration; Aerodynamics; Finite element methods; Optical sensors; Remote sensing; Stress; Vibrations; CAE analysis; Finite element method; dynamic characteristic; dynamic response; off-axis TMA Multi-spectral Remote Sensor;
Conference_Titel :
Transportation, Mechanical, and Electrical Engineering (TMEE), 2011 International Conference on
Conference_Location :
Changchun
Print_ISBN :
978-1-4577-1700-0
DOI :
10.1109/TMEE.2011.6199615