DocumentCode :
2079130
Title :
Educating under-represented minority students in electronics packaging for the 21st century
Author :
May, Gary S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
1997
fDate :
18-21 May 1997
Firstpage :
570
Lastpage :
574
Abstract :
In response to the changing ethnicity of the U.S. work force and the dearth of individuals from under-represented groups pursuing careers in technical fields, the Georgia Tech Summer Undergraduate Packaging Research and Engineering Experience for Minorities (GT-SUPREEM) has been developed to attract qualified minority students to pursue graduate degrees in electronics packaging-related disciplines. The program is conducted under the auspices of the Georgia Tech Engineering Research Center in Low-Cost Electronic Packaging, which is sponsored by the National Science Foundation. In the GT-SUPREEM program, junior and senior level undergraduate students are selected on a nationwide basis and paired with a faculty advisor to undertake research projects in the Packaging Research Center. The students are housed on campus and provided with a $3,000 stipend and a travel allowance. At the conclusion of the program, the students present both oral and written project summaries. It has been shown that this experience is extremely successful in motivating these students to attend graduate school, with 89% of the participants opting to do so. This paper will provide an overview of the GT-SUPREEM program, including student research activities, success stories, lessons learned, and overall program outlook
Keywords :
electronic engineering education; packaging; prejudicial factors; GT-SUPREEM; Georgia Tech Engineering Research Center; Low-Cost Electronic Packaging; National Science Foundation; Summer Undergraduate Packaging Research and Engineering Experience for Minorities; United States; education; electronics packaging; ethnic minorities; research projects; undergraduate students; Competitive intelligence; Educational institutions; Educational programs; Electronic components; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing; Recruitment; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-3857-X
Type :
conf
DOI :
10.1109/ECTC.1997.606226
Filename :
606226
Link To Document :
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