Title :
Removable silicon insertion stiffeners for neural probes using polyethylene glycol as a biodissolvable adhesive
Author :
Felix, Sarah ; Shah, Karan ; George, Dani ; Tolosa, Vanessa ; Tooker, Angela ; Sheth, H. ; Delima, T. ; Pannu, Satinderpall
Author_Institution :
Lawrence Livermore Nat. Lab., Livermore, CA, USA
fDate :
Aug. 28 2012-Sept. 1 2012
Abstract :
Flexible polymer probes are expected to enable extended interaction with neural tissue by minimizing damage from micromotion and reducing inflammatory tissue response. However, their flexibility prevents them from being easily inserted into the tissue. This paper describes an approach for temporarily attaching a silicon stiffener with biodissolvable polyethylene glycol (PEG) so that the stiffener can be released from the probe and extracted shortly after probe placement. A novel stiffener design with wicking channels, along with flip-chip technology, enable accurate alignment of the probe to the stiffener, as well as uniform distribution of the PEG adhesive. Insertion, extraction, and electrode function were tested in both agarose gel and a rat brain. Several geometric and material parameters were tested to minimize probe displacement during stiffener extraction. We demonstrated average probe displacement of 28 ± 9 μm.
Keywords :
adhesives; biodegradable materials; biological tissues; biomedical electrodes; flexible structures; microelectrodes; neurophysiology; polymers; probes; silicon; PEG; Si; agarose gel; biodissolvable adhesive; biodissolvable polyethylene glycol; electrode function; extraction; flexible polymer probes; flip-chip technology; insertion; microelectrode; neural probes; neural tissue; polyethylene glycol; rat brain; silicon insertion stiffeners; silicon stiffener; Assembly; Electrodes; Polymers; Probes; Silicon; Surface treatment; Animals; Biocompatible Materials; Brain; Electrodes; Polyethylene Glycols; Rats; Sepharose; Silicon; Tissue Adhesives;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
DOI :
10.1109/EMBC.2012.6346070