DocumentCode :
2079681
Title :
3D thermal modeling of a plasma assisted chemical vapor deposition process
Author :
Rouquette, Rouquette S. ; Autrique, Autrique L. ; Chaussavoine, Chaussavoine C. ; Thomas, Thomas L.
Author_Institution :
IMP-CNRS, Perpignan Univ., France
Volume :
5
fYear :
2002
fDate :
2002
Firstpage :
3813
Abstract :
Due to unique properties such as hardness, or a low friction coefficient, amorphous silicon carbide films are attractive for mechanical applications. Even if plasma assisted chemical vapor deposition processes are now commonly used for the growth of such coatings, mechanisms leading to their formations are not completely understood. However, the substrate temperature is considered as one of the key-parameters for this technique. Then in order to provide an effective predictive simulation tool or to determine optimal control procedures, a 3D thermal modeling of the plasma assisted chemical vapor deposition process has to be investigated.
Keywords :
amorphous state; finite element analysis; inverse problems; optimal control; parameter estimation; partial differential equations; plasma CVD; process control; silicon compounds; wear resistant coatings; 3D thermal modeling; SiC; amorphous silicon carbide films; chemical process; coatings; hardness; inverse problem; low friction coefficient; optimal control procedures; parameter estimation; partial differential equation; plasma assisted chemical vapor deposition process; predictive simulation tool; sensitivity analysis; substrate temperature; Amorphous silicon; Chemical vapor deposition; Friction; Mechanical factors; Plasma applications; Plasma chemistry; Plasma properties; Plasma simulation; Plasma temperature; Predictive models;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
American Control Conference, 2002. Proceedings of the 2002
ISSN :
0743-1619
Print_ISBN :
0-7803-7298-0
Type :
conf
DOI :
10.1109/ACC.2002.1024522
Filename :
1024522
Link To Document :
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