DocumentCode
2079681
Title
3D thermal modeling of a plasma assisted chemical vapor deposition process
Author
Rouquette, Rouquette S. ; Autrique, Autrique L. ; Chaussavoine, Chaussavoine C. ; Thomas, Thomas L.
Author_Institution
IMP-CNRS, Perpignan Univ., France
Volume
5
fYear
2002
fDate
2002
Firstpage
3813
Abstract
Due to unique properties such as hardness, or a low friction coefficient, amorphous silicon carbide films are attractive for mechanical applications. Even if plasma assisted chemical vapor deposition processes are now commonly used for the growth of such coatings, mechanisms leading to their formations are not completely understood. However, the substrate temperature is considered as one of the key-parameters for this technique. Then in order to provide an effective predictive simulation tool or to determine optimal control procedures, a 3D thermal modeling of the plasma assisted chemical vapor deposition process has to be investigated.
Keywords
amorphous state; finite element analysis; inverse problems; optimal control; parameter estimation; partial differential equations; plasma CVD; process control; silicon compounds; wear resistant coatings; 3D thermal modeling; SiC; amorphous silicon carbide films; chemical process; coatings; hardness; inverse problem; low friction coefficient; optimal control procedures; parameter estimation; partial differential equation; plasma assisted chemical vapor deposition process; predictive simulation tool; sensitivity analysis; substrate temperature; Amorphous silicon; Chemical vapor deposition; Friction; Mechanical factors; Plasma applications; Plasma chemistry; Plasma properties; Plasma simulation; Plasma temperature; Predictive models;
fLanguage
English
Publisher
ieee
Conference_Titel
American Control Conference, 2002. Proceedings of the 2002
ISSN
0743-1619
Print_ISBN
0-7803-7298-0
Type
conf
DOI
10.1109/ACC.2002.1024522
Filename
1024522
Link To Document