Title :
Electrode assembly design for transcranial Direct Current Stimulation: A FEM modeling study
Author :
Kronberg, G. ; Bikson, M.
Author_Institution :
Neural Eng. Dept., City Coll. of New York, New York, NY, USA
fDate :
Aug. 28 2012-Sept. 1 2012
Abstract :
Despite accelerating progress in transcranial Direct Current Stimulation clinical and cognitive research, there remains remarkably little consistency in the control of electrode design and preparation. Electrode assembly design determines skin sensation and failure at the electrode can lead to skin burns. Though tDCS is generally well tolerated, the desire for rigor in electrode design is motivated by applications in increasingly diverse environments and populations. Generally the tDCS electrode assembly consists of a flat rubber or metal electrode and a saline/water saturated sponge. Here we show using FEM simulations, that each of these factors should be controlled to regulate current flow density across the skin: 1) sponge thickness 2) solution salinity 3) electrode size, 4) electrode placement in the sponge (including surface or pocket configuration) 5) control of excess fluid at the skin surface 6) use of rivets. Two general patterns of current distribution emerge as a result of integrated design: edge concentration or center concentration. Poor control over any of these electrode assembly parameters will result in unpredictable current density at the skin during tDCS.
Keywords :
bioelectric phenomena; biomedical electrodes; brain; finite element analysis; neurophysiology; patient treatment; skin; FEM modeling; current flow density; electrode assembly design; electrode placement; electrode size; failure; flat rubber electrode; metal electrode; skin burns; skin sensation; solution salinity; sponge thickness; tDCS; transcranial direct current stimulation; Conductivity; Current density; Electrodes; Rubber; Scalp; Skin; Standards; Animals; Electric Stimulation Therapy; Electrodes; Humans; Models, Theoretical;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
DOI :
10.1109/EMBC.2012.6346075