• DocumentCode
    2080254
  • Title

    Optimizing addition for sub-threshold logic

  • Author

    Blaauw, David ; Kitchener, James ; Phillips, Braden

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    751
  • Lastpage
    756
  • Abstract
    Digital circuits operating at subthreshold-voltage levels can achieve extremely low energy consumption. Typical applications include sensor processors with modest processing requirements that must run for long intervals on a low energy supply. The design goal is to minimise the total energy required for a processing task. Optimal architectures strike a balance between leakage and dynamic dissipation: if a unit is too slow, leakage energy is wasted throughout the system; however increasing the unit´s speed may cost increased dynamic dissipation and leakage within the unit. We examine this trade-off through the simulation of a variety of adder architectures. The results show that for a 180 nm process, system leakage dominates adder switching energy. For all but the smallest systems, when the adder is on the critical timing path, overall energy consumption is minimized by choosing a fast tree adder. The results also show that high valency tree adders perform well at subthreshold levels in this process.
  • Keywords
    adders; energy consumption; logic circuits; adder architectures; adder switching energy; digital circuits; dynamic dissipation; energy consumption; leakage energy; size 180 nm; subthreshold logic; subthreshold-voltage levels; total energy; tree adder; Adders; Arithmetic; CMOS logic circuits; Delay; Energy consumption; Logic circuits; Logic design; Power engineering and energy; Threshold voltage; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signals, Systems and Computers, 2008 42nd Asilomar Conference on
  • Conference_Location
    Pacific Grove, CA
  • ISSN
    1058-6393
  • Print_ISBN
    978-1-4244-2940-0
  • Electronic_ISBN
    1058-6393
  • Type

    conf

  • DOI
    10.1109/ACSSC.2008.5074509
  • Filename
    5074509