Title :
A thermal model for planar transformers
Author :
Lewaiter, A. ; Ackermann, Bernd
Author_Institution :
Philips Res. Lab., Aachen, Germany
Abstract :
As planar technology is finding its way into applications replacing the conventional wire wound magnetic components, new design tools for these components are needed. As thermal problems can be a limiting factor for an electronic system, a thermal model should be part of the design process. We have developed a thermal model for planar transformers and applied it to an E-PLT22/16 transformer with a 4-layer PCB. The model follows the 3D geometry of the component and provides links to the environment. It is fast, parametrisable and applicable for a broad range of user-specified boundary conditions. The model is compared with measurements.
Keywords :
printed circuits; thermal analysis; transformers; 3D geometry; 4-layer PCB; E-PLT22/16 transformer; design tools; planar passive components; planar transformers; thermal model; user-specified boundary conditions; Boundary conditions; Heat sinks; Heat transfer; Magnetic separation; Resistance heating; Temperature; Thermal conductivity; Thermal factors; Transformers; Wire;
Conference_Titel :
Power Electronics and Drive Systems, 2001. Proceedings., 2001 4th IEEE International Conference on
Print_ISBN :
0-7803-7233-6
DOI :
10.1109/PEDS.2001.975399
