• DocumentCode
    2080696
  • Title

    Two complementary techniques: the thermal step technique and the thermally stimulated currents technique. Study of polycrystalline Al2O3

  • Author

    Agnel, S. ; Toureille, A.

  • Author_Institution
    Lab. d´´Electrotech., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
  • Volume
    1
  • fYear
    1997
  • fDate
    19-22, Oct 1997
  • Firstpage
    271
  • Abstract
    The information obtained using the Thermal Step Method (TSM) and the Thermally Stimulated Currents (TSC) technique are totally complementary. The TSM allows to determine and to localize the space charge density in insulating materials, while the TSC technique allows to obtain the average activation energies of the different processes of discharge or depolarization. In this paper, we discuss about the sensitivity of these two techniques to real charges and polarization. We show by coupling of these two methods that polycrystalline Al2O3 can accumulate space charges in the bulk (when the sample is poled under high DC voltage). These charges may be released when the TSC technique is applied to the sample. The charges distributions, given by the TSM, show polarization of the alumina when poled below 200°C, and a cathode electron injection above 200°C. The TSC gives the energy levels of the released charges corresponding to these phenomena
  • Keywords
    alumina; dielectric measurement; space charge; thermally stimulated currents; 200 C; Al2O3; activation energy; cathode electron injection; depolarization; discharge; insulating material; polarization; poling; polycrystalline Al2O3; space charge density; thermal step method; thermally stimulated currents technique; Aluminum oxide; Charge measurement; Current measurement; Dielectrics and electrical insulation; Electric variables measurement; Electrodes; Energy measurement; Polarization; Space charge; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on
  • Conference_Location
    Minneapolis, MN
  • Print_ISBN
    0-7803-3851-0
  • Type

    conf

  • DOI
    10.1109/CEIDP.1997.634611
  • Filename
    634611