Title :
Perspective of RF design in future planar and FinFET CMOS
Author :
Borremans, J. ; Parvais, B. ; Dehan, M. ; Thijs, S. ; Wambacq, P. ; Mercha, A. ; Kuijk, M. ; Carchon, G. ; Decoutere, S.
Author_Institution :
IMEC, Leuven
fDate :
June 17 2008-April 17 2008
Abstract :
Scaling of CMOS transistors beyond 45 nm requires architectural redesign of the devices. FinFETs are proposed to recover the reduced channel control. This work evaluates the perspective of RF design in planar bulk vs. FinFET SOI for (sub-)45 nm CMOS on a key RF circuit: a low-noise amplifier (LNA). The planar and FinFET devices with channel lengths down to 40 nm are compared in both wideband and narrowband designs up to 14 GHz to illustrate the RF and ESD protection performance perspective. Planar devices push the RF performance. FinFETs lag somewhat behind, but show promising RF performance.
Keywords :
CMOS integrated circuits; MOSFET; electrostatic discharge; integrated circuit design; low noise amplifiers; radiofrequency integrated circuits; silicon-on-insulator; CMOS transistor scaling; ESD protection; FinFET CMOS; RF design; architectural redesign; low-noise amplifier; planar devices; silicon-on-insulator; Circuit noise; Electrostatic discharge; FinFETs; High K dielectric materials; Narrowband; Protection; Radio frequency; Silicon; Transistors; Wideband; CMOS; FinFET; LNA; RF; planar; scaling;
Conference_Titel :
Radio Frequency Integrated Circuits Symposium, 2008. RFIC 2008. IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-1808-4
Electronic_ISBN :
1529-2517
DOI :
10.1109/RFIC.2008.4561389