Title :
Flip chip assembly of Motorola fast static RAM known good die
Author :
Beddingfield, Craig ; Kost, Don
Author_Institution :
Adv. Interconnect Syst. Lab., Motorola Inc., Austin, TX, USA
Abstract :
The Motorola Fast Static RAM Division has developed and introduced into production a process for manufacturing Known Good Die (KGD). This process uses a die level carrier and can accomodate both wire bond and solder-bumped die. This paper discusses the die level KGD manufacturing process as well as assembly results for direct chip attach of solder-bumped KGD. The discussion includes carrier design, manufacturing flow, test strategy and assembly evaluation/characterization of KGD. The assembly characterization includes metrology measurements of solder bumps, die placement capability and joint integrity as measured by stud pull and evaluated by cross-sectioning
Keywords :
SRAM chips; flip-chip devices; inspection; integrated circuit manufacture; integrated circuit measurement; integrated circuit packaging; lead bonding; microassembling; reflow soldering; Motorola; assembly characterization; assembly evaluation; carrier design; cross-sectioning; die level KGD manufacturing process; die level carrier; die placement capability; direct chip attach; fast static RAM; flip chip assembly; joint integrity; known good die; manufacturing; metrology measurements; production a process; solder-bumped die; stud pull; test strategy; wire bond die; Assembly; Bonding; Contacts; Flip chip; Integrated circuit interconnections; Manufacturing processes; Packaging machines; Substrates; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606239
