Flip chip assembly of Motorola fast static RAM known good die

Author

Beddingfield, Craig ; Kost, Don

Author_Institution

Adv. Interconnect Syst. Lab., Motorola Inc., Austin, TX, USA

fYear

1997

fDate

18-21 May 1997

Firstpage

643

Lastpage

648

Abstract

The Motorola Fast Static RAM Division has developed and introduced into production a process for manufacturing Known Good Die (KGD). This process uses a die level carrier and can accomodate both wire bond and solder-bumped die. This paper discusses the die level KGD manufacturing process as well as assembly results for direct chip attach of solder-bumped KGD. The discussion includes carrier design, manufacturing flow, test strategy and assembly evaluation/characterization of KGD. The assembly characterization includes metrology measurements of solder bumps, die placement capability and joint integrity as measured by stud pull and evaluated by cross-sectioning

Keywords

SRAM chips; flip-chip devices; inspection; integrated circuit manufacture; integrated circuit measurement; integrated circuit packaging; lead bonding; microassembling; reflow soldering; Motorola; assembly characterization; assembly evaluation; carrier design; cross-sectioning; die level KGD manufacturing process; die level carrier; die placement capability; direct chip attach; fast static RAM; flip chip assembly; joint integrity; known good die; manufacturing; metrology measurements; production a process; solder-bumped die; stud pull; test strategy; wire bond die; Assembly; Bonding; Contacts; Flip chip; Integrated circuit interconnections; Manufacturing processes; Packaging machines; Substrates; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606239

Filename

606239