DocumentCode :
20813
Title :
ICCAD Roundtable The Many Challenges of Triple Patterning [ICCAD Roundtable]
Volume :
31
Issue :
4
fYear :
2014
fDate :
Aug. 2014
Firstpage :
52
Lastpage :
58
Abstract :
Presents a roundtable discussion which focuses on the move from double patterning to triple patterning and beyond. What is the status of triple patterning today, and what does it really solve? At what dimension will it show its benefit? Will quadruple patterning be next, and when? How does multiple patterning fit in with a roadmap that includes extreme ultraviolet (EUV), direct write, and directed self-assembly? The panelists discuss the state of the art and future challenges.
Keywords :
Integrated circuit manufacturing; Lithography; Moore´s Law; Pattern recognition; Photoresistivity; Ultraviolet sources;
fLanguage :
English
Journal_Title :
Design & Test, IEEE
Publisher :
ieee
ISSN :
2168-2356
Type :
jour
DOI :
10.1109/MDAT.2014.2337471
Filename :
6874606
Link To Document :
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