DocumentCode
20813
Title
ICCAD Roundtable The Many Challenges of Triple Patterning [ICCAD Roundtable]
Volume
31
Issue
4
fYear
2014
fDate
Aug. 2014
Firstpage
52
Lastpage
58
Abstract
Presents a roundtable discussion which focuses on the move from double patterning to triple patterning and beyond. What is the status of triple patterning today, and what does it really solve? At what dimension will it show its benefit? Will quadruple patterning be next, and when? How does multiple patterning fit in with a roadmap that includes extreme ultraviolet (EUV), direct write, and directed self-assembly? The panelists discuss the state of the art and future challenges.
Keywords
Integrated circuit manufacturing; Lithography; Moore´s Law; Pattern recognition; Photoresistivity; Ultraviolet sources;
fLanguage
English
Journal_Title
Design & Test, IEEE
Publisher
ieee
ISSN
2168-2356
Type
jour
DOI
10.1109/MDAT.2014.2337471
Filename
6874606
Link To Document