mini Ball Grid Array (mBGA) assembly on MCM-L boards

Sandia National Laboratories has developed a chip scale packaging technology called mini Ball Grid Array (mBGA). The mBGA is a flip chip die, obtained by redistributing peripheral pads in existing dies to an area array of pads 10 mils or larger in diameter with a minimum pitch of 20 mils. The peripheral pads are redistributed to area array pads using two polyimide dielectric and two metal conductor layers. mBGA can be closely tiled together on a substrate to yield a very high circuit density. In an earlier report, we presented the results on the reliability and thermal performance of mBGA on silicon and ceramic substrates. In this report, we present an mBGA cost analysis, improvement in the mBGA bump adhesion, and reliability and thermal performance of mBGA assemblies on FR-4 boards