• DocumentCode
    2083152
  • Title

    Calculation of Three-Dimensional Passive Structures Including Bond-Wires, Via-Holes and Air-Bridges using the Spectral Domain Analysis Method

  • Author

    Becks, T. ; Wolff, I.

  • Author_Institution
    Department of Electrical Engineering and Sonderforschungsbereich 254, Duisburg University, Bismarckstr. 81, D-4100 Duisburg, FRG
  • Volume
    1
  • fYear
    1991
  • fDate
    9-12 Sept. 1991
  • Firstpage
    571
  • Lastpage
    576
  • Abstract
    A full-wave analysis method for the investigation of microstrip- and coplanar-structures including bond-wires, via-holes, gate-fingers and air-bridges is presented. For the first time spectral domain analysis technique is used to calculate the S-parameters of real three-dimensional metallization structures. The general formulation and the procedure of the method are described.
  • Keywords
    Bonding; Circuits; Current density; Integral equations; Metallization; Microstrip; Scattering parameters; Spectral analysis; Surface treatment; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1991. 21st European
  • Conference_Location
    Stuttgart, Germany
  • Type

    conf

  • DOI
    10.1109/EUMA.1991.336363
  • Filename
    4136347
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2083152