Title :
Calculation of Three-Dimensional Passive Structures Including Bond-Wires, Via-Holes and Air-Bridges using the Spectral Domain Analysis Method
Author :
Becks, T. ; Wolff, I.
Author_Institution :
Department of Electrical Engineering and Sonderforschungsbereich 254, Duisburg University, Bismarckstr. 81, D-4100 Duisburg, FRG
Abstract :
A full-wave analysis method for the investigation of microstrip- and coplanar-structures including bond-wires, via-holes, gate-fingers and air-bridges is presented. For the first time spectral domain analysis technique is used to calculate the S-parameters of real three-dimensional metallization structures. The general formulation and the procedure of the method are described.
Keywords :
Bonding; Circuits; Current density; Integral equations; Metallization; Microstrip; Scattering parameters; Spectral analysis; Surface treatment; Wire;
Conference_Titel :
Microwave Conference, 1991. 21st European
Conference_Location :
Stuttgart, Germany
DOI :
10.1109/EUMA.1991.336363
