• DocumentCode
    2083312
  • Title

    Wafer by Wafer Low Dose Rate Qualification in a Production Environment

  • Author

    van Vonno, N.W. ; Pearce, L.G. ; Northen, A.L. ; Touvell, J.R. ; Brewster, J.C. ; Gill, J.S. ; Thomson, E.T. ; Chesley, P.J. ; Schettler, D.

  • Author_Institution
    Intersil Corp., Palm Bay, FL, USA
  • fYear
    2011
  • fDate
    25-29 July 2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    We report details of a low dose rate wafer by wafer acceptance testing program proposed for Intersil RHA products, including sampling and test methods. We also discuss the design of a vault-type 60Co irradiation facility.
  • Keywords
    radiation hardening (electronics); semiconductor device manufacture; semiconductor device testing; Co; hardness qualification testing; low dose rate qualification; production environment; radiation hardening; sampling method; test method; vault-type irradiation facility; wafer acceptance testing program; BiCMOS integrated circuits; CMOS integrated circuits; Military standards; Production; Qualifications; Radiation effects; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation Effects Data Workshop (REDW), 2011 IEEE
  • Conference_Location
    Las Vegas, NV
  • ISSN
    2154-0519
  • Print_ISBN
    978-1-4577-1281-4
  • Type

    conf

  • DOI
    10.1109/REDW.2010.6062512
  • Filename
    6062512
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2083312