Title :
Wafer by Wafer Low Dose Rate Qualification in a Production Environment
Author :
van Vonno, N.W. ; Pearce, L.G. ; Northen, A.L. ; Touvell, J.R. ; Brewster, J.C. ; Gill, J.S. ; Thomson, E.T. ; Chesley, P.J. ; Schettler, D.
Author_Institution :
Intersil Corp., Palm Bay, FL, USA
Abstract :
We report details of a low dose rate wafer by wafer acceptance testing program proposed for Intersil RHA products, including sampling and test methods. We also discuss the design of a vault-type 60Co irradiation facility.
Keywords :
radiation hardening (electronics); semiconductor device manufacture; semiconductor device testing; Co; hardness qualification testing; low dose rate qualification; production environment; radiation hardening; sampling method; test method; vault-type irradiation facility; wafer acceptance testing program; BiCMOS integrated circuits; CMOS integrated circuits; Military standards; Production; Qualifications; Radiation effects; Testing;
Conference_Titel :
Radiation Effects Data Workshop (REDW), 2011 IEEE
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4577-1281-4
DOI :
10.1109/REDW.2010.6062512
