Integration of thin film passive circuits using high/low dielectric constant materials

Integration of passives is a continuous challenge towards achieving high performance packages with low profile, improved reliability, maximum packaging efficiency and low cost. This paper discusses the design, fabrication and measurement of integrated passive structures using dielectric constants of 3.3 and 9.1, and thickness in the range of 10-21 μm for wireless applications. The use of polymer-ceramic composite material provides the design flexibility to combine both high dielectric constant and low dielectric constant materials within a single module. This allows for the design of matching networks, RF filters and ability to decouple power supplies for mixed signal applications with reduced size