• DocumentCode
    2083531
  • Title

    Analysis of the electromagnetic radiation behaviour of motherboard-subboard structures

  • Author

    Valek, M. ; Leone, M. ; Schmiedl, F.

  • Author_Institution
    Centre for Quality Eng., Siemens AG, Germany
  • fYear
    2005
  • fDate
    21-24 June 2005
  • Firstpage
    175
  • Lastpage
    178
  • Abstract
    Due to its antenna nature, subboard-on-motherboard structures act as unintentional radiators of electromagnetic fields. The magnitude of the electromagnetic emissions can exceed even the CISPR 22 limits, when high-speed signals are routed through the interboard connector. A worst-case analysis of the maximum field strength radiated from two mutually-parallel motherboard-subboard PCBs is presented in this paper. A detailed investigation of the radiation behaviour of motherboard-subboard structures leads to the conclusion that with a suitable pin configuration of the interboard connector the field emission can be considerably reduced. It is shown that further field suppression can be achieved, if grounding posts are introduced into the system design.
  • Keywords
    antenna radiation patterns; electric field measurement; electromagnetic fields; electromagnetic interference; printed circuit design; printed circuit testing; CISPR 22 limit; antenna nature; electromagnetic field; electromagnetic radiation behaviour; field suppression; interboard connector; maximum field strength; motherboard-subboard structure; mutually-parallel PCB; pin configuration; unintentional radiator; Circuit simulation; Connectors; Coupling circuits; Electromagnetic analysis; Electromagnetic fields; Electromagnetic radiation; Grounding; Integrated circuit modeling; Printed circuits; Surface waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and Electromagnetic Ecology, 2005. IEEE 6th International Symposium on
  • Print_ISBN
    0-7803-9374-0
  • Type

    conf

  • DOI
    10.1109/EMCECO.2005.1513094
  • Filename
    1513094