• DocumentCode
    2083886
  • Title

    130nm Single Event Upset Performance Evaluation: Commercial vs. Hardened by Design Architectures

  • Author

    Dumitru, Radu ; Hafer, Craig ; Wu, Tzu-Wen ; Rominger, Rob ; Milliken, Peter ; Bruno, Kevin ; Farris, Teresa

  • Author_Institution
    Aeroflex Colorado Springs, Colorado Springs, CO, USA
  • fYear
    2011
  • fDate
    25-29 July 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Two test chips have been built and SEE data has been collected to validate the radiation hardness of both commercial and Hardened-by-Design elements on a 130nm RadHard-by-Design ASIC Library.
  • Keywords
    application specific integrated circuits; radiation hardening (electronics); RadHard-by-design ASIC library; design architectures; hardened-by-design elements; radiation hardness; single event upset performance evaluation; size 130 nm; test chips; Clocks; Flip-flops; Libraries; Radiation effects; Single event upset; Springs; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation Effects Data Workshop (REDW), 2011 IEEE
  • Conference_Location
    Las Vegas, NV
  • ISSN
    2154-0519
  • Print_ISBN
    978-1-4577-1281-4
  • Type

    conf

  • DOI
    10.1109/REDW.2010.6062538
  • Filename
    6062538
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2083886